SIGMOBILE 1997-98 Annual Report

Collaborative Efforts with Other SIGs or Sibling Societies
 
MobiCom'97 was co-sponsored by ACM SIGCOMM, the IEEE Communications Society, and the Hungarian Academy of Sciences, with support from HP, IBM, and Westel 900. MobiCom'98 is being co-sponsored by ACM SIGCOMM and the IEEE Communications Society, with support from Microsoft Research.
 
Future Plans
 
Our membership experienced notable growth after MobiCom'97. Our retention rate has also been fairly high, and when we consider that there were no major membership promotion campaigns during this period, this is very encouraging. This year, we intend to aggressively pursue plans to attract new members. Our Director of Membership is working closely with the MobiCom'98 registration chair to come up with innovative ways of attracting new members.

Our flagship conference, MobiCom'98, will be held October 25-30, 1998, in Dallas, Texas. The number of papers submitted to the conference this year was an all-time high of 148, an increase of 46% over last year's conference. This indicates a substantial increase in interest and coverage for both SIGMOBILE and MobiCom. Also this year, one of our corporate supporters donated funds for the Best Student Paper Award. These funds will enable us to create plaques for all the winners of this Award since 1995. The 1998 Award plaque (along with an honorarium) will be presented during the conference in Dallas, while winners from previous years will be mailed their plaques shortly thereafter.

MobiCom'99 will be held in Seattle, Washington, and MobiCom 2000 is planned for Europe.
 
Listing of Computer and Other Equipment Purchases
 
None.