Artifact Evaluation Committee
Artifact Evaluation Chairs
- Wei Gao weigao@pitt.edu University of Pittsburgh
- Shijia Pan span24@ucmerced.edu University of California Merced US
Artifact Evaluation Reviewers
- Ananta Narayanan Balaji ananta@comp.nus.edu.sg Nokia Bell Labs
- Baicheng Chen b3chen@ucsd.edu UC San Diego
- Baodi Shan baodi.shan@stonybrook.edu Stony Brook University
- Bocheng Chen chenboc1@msu.edu Michigan State University
- Di Duan dduan5-c@my.cityu.edu.hk City University of Hong Kong
- Dong Yoon Lee dlee267@ucmerced.edu UC Merced
- Dongqi Cai cdq@bupt.edu.cn Beijing University of Posts and Telecommunications
- Dunna Manideep mdunna@ucsd.edu UC San Diego
- Hanqing Guo guohanqi@msu.edu Michigan State University
- Hao Zhou hao.zhou@psu.edu PennState
- Haoxiang Yu hxyu@utexas.edu The University of Texas at Austin
- Hong Jia h.jia@unimelb.edu.au University of Melbourne
- Hongbo Wang hongbo001@ntu.edu.sg Nanyang Technological University
- Huanqi Yang huanqi.yang@my.cityu.edu.hk City University of Hong Kong
- Ish Jain ikjain@ucsd.edu UC San Diego
- Jesse Codling codling@umich.edu University of Michigan
- Jiale Zhang jiale@umich.edu University of Michigan Ann Arbor
- Distinguished Artifact Reviewer Leming Shen leming.shen@connect.polyu.hk The Hong Kong Polytechnic University
- Matthew Corbett matthewc84@vt.edu Virginia Tech
- Distinguished Artifact Reviewer Nakul Garg nakul22@umd.edu University of Maryland College park
- Nhat Pham phamn@cardiff.ac.uk Cardiff University
- Pranjol Sen Gupta pranjolsen.gupta@mavs.uta.edu University of Texas at Arlington
- Rohal Shubham srohal@ucmerced.edu University of California Merced
- Shiming Yu shiming.yu@connect.polyu.hk The Hong Kong Polytechnic University
- Shivang Aggarwal shivang.aggarwal@hpe.com Hewlett Packard Labs
- Soundarya Ramesh sramesh@comp.nus.edu.sg National University of Singapore
- Taesik Gong taesik.gong@nokia-bell-labs.com Nokia Bell Labs
- Tao Ni taoni2-c@my.cityu.edu.hk City University of Hong Kong
- Venkatesh Kodukula vkoduku1@asu.edu Amazon Lab126
- Xiaomin Ouyang xmouyang23@g.ucla.edu University of California Los Angeles
- Yang Liu yl868@cam.ac.uk University of Cambridge
- Yi-Chao Chen yichao@sjtu.edu.cn Shanghai Jiao Tong University
- Yidong Ren renyidon@msu.edu Michigan State University
- Yuning Chen ychen372@ucmerced.edu University of California Merced
- Yuyan Wu wuyuyan@stanford.edu Stanford University
- Yuze He yzhh@link.cuhk.edu.hk The Chinese University of Hong Kong
- Zehua Sun zehua.sun@my.cityu.edu.hk City University of Hong Kong
- Zelei Cheng zelei.cheng@northwestern.edu Northwestern University
- Zhaoxin Chang zhaoxin.chang@telecom-sudparis.eu Institut Polytechnique de Paris
- Zhihe Zhao 1155170475@link.cuhk.edu.hk CUHK
- Zhiyuan Xie zyxie@cuhk.edu.hk The Chinese University of Hong Kong
- Zifei Zhong zhongz@email.sc.edu University of South Carolina
- Zongxing Xie zongxing.xie@stonybrook.edu Stony Brook University
